Specific Process Knowledge/Lithography/Resist/DUVresist: Difference between revisions

Revision as of 15:37, 27 January 2023

DUV resist overview

The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.

Information about resist can be found here:

Bottom Anti Reflection Coating (BARC) DUV 42S-6 Datasheet DUV42S-6.
Positive DUV resist for spin coating in 600-300nm thickness range KRF M230Y.
Positive DUV resist for spin coating in 1600-800nm thickness range KRF M35G.
Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range UVN2300-0.8.

Revision as of 15:07, 26 January 2023 view source Jehem (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip 1,298 edits →‎DUV resist ← Older edit		Revision as of 15:37, 27 January 2023 view source Jehem (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip 1,298 edits →‎DUV resist overview Newer edit →
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	==DUV resist overview==		===DUV resist overview===
	The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.		The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.