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Specific Process Knowledge/Lithography/EBeamLithography/EBLLandingpage: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Thope (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
2,179 edits
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[[File:EBLWorkflow.png|1200px|frameless|center|alt=Generalized EBL workflow.|Generalized EBL workflow.]]
[[File:EBLWorkflow.png|1200px|frameless|center|alt=Generalized EBL workflow.|Generalized EBL workflow.]]


While substrate preparation and development processes are (nearly) identical for the JEOL and Raith eLine systems, pattern preparation, job preparation and job execution are fairly different and all details are found under the respective tool pages.
Since substrate preparation and development processes are (nearly) identical for the JEOL and Raith eLine systems they are described in common below. Pattern preparation, job preparation and job execution are fairly different between the two tools and hence these steps are described on the specific tool pages.


= E-beam resists =
= E-beam resists =
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