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| =Spin coaters at DTU Nanolab= | | =Spin coaters at DTU Nanolab= |
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| | | {{:Specific Process Knowledge/Lithography/Coaters/GammaUV}} |
| ==Spin Coater: Gamma UV==
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| [[image:SpinCoaterGammaUV.jpg|400px|right|thumb|Spin Coater: Gamma UV in E-5]]
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| '''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV click here]'''
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| ''[[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]''
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| Spin Coater: Gamma UV was installed at DTU Nanolab in March 2015. It is a Gamma 2M cluster from Süss MicroTec with spin coating, vapour priming, and baking modules. The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".
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| The coater is equipped with 3 different resists lines:
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| *AZ MiR 701
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| *AZ nLOF 2020
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| *AZ 5214E
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| and
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| *1 syringe, which can be used for various resists.
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| The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.
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| '''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''
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| '''The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]'''
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| ===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]===
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| [[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information|General Process Information]]
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| [[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes|Standard Processes:]]
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| *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_.28QC.29|Quality Control (QC)]]
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| *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#HMDS_priming_2|HMDS]]
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| *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_MiR_701_.2829cps.29_coating|AZ MiR 701]]
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| *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_nLOF_2020_coating|AZ nLOF 2020]]
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| *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_5214E_coating|AZ 5214E]]
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| [[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes|Syringe processes]]
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| === Equipment performance and process related parameters ===
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| {| border="2" cellspacing="0" cellpadding="2"
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| !style="background:silver; color:black;" align="center" width="60"|Purpose
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| *HMDS priming
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| *Spin coating of PGMEA based UV resists
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| *Spin coating of E-beam resists <sup>1)</sup>
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| *Soft baking
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| |-
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| !style="background:silver; color:black;" align="center" width="60"|Resist
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * AZ MiR 701 (29cps)
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| * AZ nLOF 2020
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| * AZ 5214E
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| * 60cc syringe dispense
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
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| |style="background:LightGrey; color:black"|HMDS contact angle
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 60 - 80°
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| |-
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| |style="background:LightGrey; color:black"|Coating thickness
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * AZ MiR 701: 1.5-4 µm
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| * AZ nLOF 2020: 1.5-5 µm
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| * AZ 5214E: 1.5-5 µm
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| * AZ 4562: 5-15 µm
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters
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| |style="background:LightGrey; color:black"|Priming temperature
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 120 °C
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| |-
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| |style="background:LightGrey; color:black"|Spin speed
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 10 - 6000 rpm
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| |-
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| |style="background:LightGrey; color:black"|Spin acceleration
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 10 - 10000 rpm/s
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| |-
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| |style="background:LightGrey; color:black"|Hotplate temperature
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 25 - 200 °C
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| |-
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| |style="background:LightGrey; color:black"|Cool plate temperature
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 21 °C
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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| |style="background:LightGrey; color:black"|Substrate size
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * 50 mm wafers <sup>1)</sup>
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| * 100 mm wafers
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| * 150 mm wafers
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| * 200 mm wafers <sup>1)</sup>
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| |-
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| | style="background:LightGrey; color:black"|Allowed materials
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| |style="background:WhiteSmoke; color:black" align="center"|
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| Silicon and glass
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| No resist or crystalbond allowed in the HMDS module
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| |-
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| |style="background:LightGrey; color:black"|Batch
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| |style="background:WhiteSmoke; color:black" align="center"|
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| 1 - 25
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| |-
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| |}
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| <sup>1)</sup> Requires tool change.
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| <br clear="all" />
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| ==Spin Coater: Gamma E-beam and UV== | | ==Spin Coater: Gamma E-beam and UV== |
