Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
| Line 204: | Line 204: | ||
hexamethyldisilazane (HMDS) | hexamethyldisilazane (HMDS) | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | ||
|style="background:LightGrey; color:black"|Contact angle | |style="background:LightGrey; color:black"|Contact angle | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* Si (native oxide): 77.8° | * Si (native oxide): 77.8° | ||
* SiO<sub>2</sub> (110 nm): 81.7° | * SiO<sub>2</sub> (110 nm): 81.7° | ||
* Boron Glass: 97.6° | * Boron Glass: 97.6° | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Fast recipe [standard recipe]: | Fast recipe [standard recipe]: | ||
* Si (native oxide): 72.9° [81.0°] | * Si (native oxide): 72.9° [81.0°] | ||
| Line 223: | Line 216: | ||
* Boron Glass: 90.7° [96.2°] | * Boron Glass: 90.7° [96.2°] | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | ||
|style="background:LightGrey; color:black"|Process temperature | |style="background:LightGrey; color:black"|Process temperature | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
150°C | 150°C | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
120°C | 120°C | ||
|- | |- | ||