Specific Process Knowledge/Thermal Process/RTP Annealsys: Difference between revisions

@@ Line 53: / Line 53: @@
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Pressure
-|style="background:LightGrey; color:black"|Valve
+|style="background:LightGrey; color:black"|Valve (APC)
 |style="background:WhiteSmoke; color:black"|
 *0 - 100
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 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*Up to 6" wafer with full view
+*Single-wafer process
 |-
 |style="background:LightGrey; color:black"|Sample size
 |style="background:WhiteSmoke; color:black"|
-*Up to 6" wafer with full view
+*100 mmm or 150 mm wafers
 |-
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black"|
-*Any standard cleanroom material
+*Silicon
+*Silicon Nitride
+*Aluminum Oxide
 |-
 |}
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