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Specific Process Knowledge/Lithography/Strip: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
2,000 edits
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|-
|'''Process temperature'''
|'''Process temperature'''
|Up to 60 <sup>o</sup>C
|Up to 60°C


|Up to 60 <sup>o</sup>C
|Up to 60°C


|-
|-
Line 344: Line 344:
|'''Batch size'''
|'''Batch size'''
|
|
1-25 wafers at a time
1 - 25 wafers
|
|
1-25 wafer at a time
1 - 25 wafers
|-
|-
|'''Size of substrate'''
|'''Size of substrate'''
|
|
4" wafers
*100 mm wafers
6" wafers
*150 mm wafers
|
|
4" wafers
*100 mm wafers
6" wafers
*150 mm wafers
|-
|-
|'''Allowed materials'''
|'''Allowed materials'''
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