Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions
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The most suitable removal power was 40 W, removing the bottom of the profile correctly without damaging the top part of the profile. | The most suitable removal power was 40 W, removing the bottom of the profile correctly without damaging the top part of the profile. | ||
[[File:nH E-time.png| | [[File:nH E-time.png|500px|left|thumb|'''''Nanoholes profile when varying the ramping E-time .''''']] | ||
{| border="1" style="text-align: center; width: 650px; height: 200px" | |||
|+ 200nm nanoholes recipe from March 2022 | |||
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! !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) | |||
|- | |||
| '''O-step''' || 10 || 220 mTorr || 200 || 0 || 40 | |||
|- | |||
| '''R-step''' || 10 || 100% || 0 || 40 || * | |||
|- | |||
| '''E<sub>1</sub>-step''' || 2 || 220 mTorr || 0 || 350 || 0 | |||
|- | |||
| '''E<sub>2</sub>-step''' || 0-15 || 220 mTorr || 0 || 350 || 100-300 | |||
|} ''*The R-power value was changed and observed.'' | |||
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