Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions

@@ Line 66: / Line 66: @@
 !  !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W)
 |-
-| '''O-step''' ||  ||  ||  ||  ||
+| '''O-step''' || 10 || 220 mTorr || 200 || 0 || 40
 |-
-| '''R-step''' ||  ||  ||  ||  ||
+| '''R-step''' || 10 || 100% || 0 || 40 || *
 |-
-| '''E<sub>1</sub>-step''' ||  ||  ||  ||  ||
+| '''E<sub>1</sub>-step''' || 2 || 220 mTorr || 0 || 350 || 0
 |-
-| '''E<sub>2</sub>-step''' ||  ||  ||  ||  ||
+| '''E<sub>2</sub>-step''' || 0-15 || 220 mTorr || 0 || 350 || 100-300
-|}
+|} *The R-power value was changed and observed.
 [[File:nH R-power.png|400px|left|thumb|'''''Nanoholes profile when varying the removal power.''''']]