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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions

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Mfarin (talk | contribs)
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{| border="1" style="text-align: center; width: 650px; height: 200px"
{| border="1" style="text-align: center; width: 700px; height: 200px"
|+ 1μm holes recipe from March 2022 - #288 = 120 min
|+ 1μm holes recipe from March 2022 - #288 = 120 min
|-
|-
|-style="background:LightGray; color:Black"
|-style="background:LightGray; color:Black"
! [[File:17.6 holes.png|400px|thumb|'''''17.6 μm holes profile.''''']] !! Time (s) !! Pressure !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) !! Coil power (W)
! [[File:17.6 holes.png|200px|thumb|'''''17.6 μm holes profile.''''']] !! Time (s) !! Pressure !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) !! Coil power (W)
|-
|-
| '''O-step''' || 10 || 220 mTorr || 200 || 0 || 40 || 0
| '''O-step''' || 10 || 220 mTorr || 200 || 0 || 40 || 0