Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions

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NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
745 edits
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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=


<!--''By Maria Farinha @nanolab, Jan 2023''
<!--
 
''By Maria Farinha @nanolab, Jan 2023''


'''''Important!''''' The pressure settings used below '''''may no longer be permitted''''', always check with the Dry etch group.
'''''Important!''''' The pressure settings used below '''''may no longer be permitted''''', always check with the Dry etch group.
Line 15: Line 17:
=== Pillars ===
=== Pillars ===


[[File:compare pillars.png|600px|left|thumb|'''''Pillars with different etching times.''''']]
[[File:compare pillars.png|600px|thumb|'''''Pillars with different etching times.''''']]
{| border="1" style="text-align: center; width: 650px; height: 200px"
{| border="1" style="text-align: center; width: 650px; height: 200px"
|+ Pillar recipe: 1 μm wide, 8 μm deep, from March 2022
|+ 1μm Pillar recipe from March 2022
|-
|-
|-style="background:DarkGray; color:White"
|-style="background:DarkGray; color:White"
Line 30: Line 32:
| '''E<sub>2</sub>-step''' || 7 || 4% || 0 || 350 || 300
| '''E<sub>2</sub>-step''' || 7 || 4% || 0 || 350 || 300
|}
|}
<br clear="all" />
 
<br>
 


=== Holes ===
=== Holes ===


{| border="1" style="text-align: center; width: 750px; height: 200px"
{| border="1" style="text-align: center; width: 650px; height: 200px"
|+ Holes recipe: 1 μm wide, 17.6 μm deep holes, from March 2022
|+ 1μm holes recipe from March 2022
|-
|-
|-style="background:DarkGray; color:White"
|-style="background:DarkGray; color:White"
!  !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) !! Coil power (W)
!  !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W)
|-
|-
| '''O-step''' || 10 || 220 mTorr || 200 || 0 || 40 || 0
| '''O-step''' || || || || ||  
|-
|-
| '''R-step''' || 10 || 100% || 0 || 100 || 40 || 0
| '''R-step''' || || || || ||  
|-
|-
| '''E<sub>1</sub>-step''' || 2 || 220 mTorr || 0 || 1200 || 0 || 0
| '''E<sub>1</sub>-step''' || || || || ||  
|-
|-
| '''E<sub>2</sub>-step''' || 1-5* || 220 mTorr || 0 || 1200 || 1 || 2000
| '''E<sub>2</sub>-step''' || || || || ||  
|}*Ramping during the E<sub>2</sub>-step, from 1 to 5 seconds.
|}


{| border="1" style="text-align: center; width: 750px; height: 200px"
|+ Holes
|-
|-style="background:DarkGray; color:White"
! Profile pictures -
|-
| '''O-step'''
|}


=== Nanoholes ===
=== Nanoholes ===
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| '''E<sub>2</sub>-step''' ||  ||  ||  ||  ||  
| '''E<sub>2</sub>-step''' ||  ||  ||  ||  ||  
|}
|}


=== Isotropic etch ===
=== Isotropic etch ===

Revision as of 16:20, 18 January 2023

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