Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions
Line 4: | Line 4: | ||
=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]= | =<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]= | ||
''By Maria Farinha @nanolab, Jan 2023'' | <!--''By Maria Farinha @nanolab, Jan 2023'' | ||
'''''Important!''''' The pressure settings used below '''''may no longer be permitted''''', always check with the Dry etch group. | '''''Important!''''' The pressure settings used below '''''may no longer be permitted''''', always check with the Dry etch group. | ||
Line 15: | Line 15: | ||
=== Pillars === | === Pillars === | ||
[[File:compare pillars.png|600px|thumb|'''''Pillars with different etching times.''''']] | [[File:compare pillars.png|600px|left|thumb|'''''Pillars with different etching times.''''']] | ||
{| border="1" style="text-align: center; width: 650px; height: 200px" | {| border="1" style="text-align: center; width: 650px; height: 200px" | ||
|+ | |+ Pillar recipe: 1 μm wide, 8 μm deep, from March 2022 | ||
|- | |- | ||
|-style="background:DarkGray; color:White" | |-style="background:DarkGray; color:White" | ||
Line 30: | Line 30: | ||
| '''E<sub>2</sub>-step''' || 7 || 4% || 0 || 350 || 300 | | '''E<sub>2</sub>-step''' || 7 || 4% || 0 || 350 || 300 | ||
|} | |} | ||
<br clear="all" /> | |||
<br> | |||
=== Holes === | === Holes === | ||
{| border="1" style="text-align: center; width: | {| border="1" style="text-align: center; width: 750px; height: 200px" | ||
|+ | |+ Holes recipe: 1 μm wide, 17.6 μm deep holes, from March 2022 | ||
|- | |- | ||
|-style="background:DarkGray; color:White" | |-style="background:DarkGray; color:White" | ||
! !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) | ! !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) !! Coil power (W) | ||
|- | |||
| '''O-step''' || 10 || 220 mTorr || 200 || 0 || 40 || 0 | |||
|- | |||
| '''R-step''' || 10 || 100% || 0 || 100 || 40 || 0 | |||
|- | |- | ||
| ''' | | '''E<sub>1</sub>-step''' || 2 || 220 mTorr || 0 || 1200 || 0 || 0 | ||
|- | |- | ||
| ''' | | '''E<sub>2</sub>-step''' || 1-5* || 220 mTorr || 0 || 1200 || 1 || 2000 | ||
|}*Ramping during the E<sub>2</sub>-step, from 1 to 5 seconds. | |||
{| border="1" style="text-align: center; width: 750px; height: 200px" | |||
|+ Holes | |||
|- | |- | ||
| | |-style="background:DarkGray; color:White" | ||
! Profile pictures - | |||
|- | |- | ||
| ''' | | '''O-step''' | ||
|} | |} | ||
=== Nanoholes === | === Nanoholes === | ||
Line 68: | Line 74: | ||
| '''E<sub>2</sub>-step''' || || || || || | | '''E<sub>2</sub>-step''' || || || || || | ||
|} | |} | ||
=== Isotropic etch === | === Isotropic etch === | ||
--> | --> |