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Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 01 processing: Difference between revisions

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==Exposure dose and defocus parameters==
==Exposure dose and defocus parameters==
The exposure dose needed in the Aligner: Maskless 01 seems to follow the dose needed to process the same substrate in [[Specific_Process_Knowledge/Lithography/UVExposure_Dose#Aligner:_MA6_-_2|Aligner: MA6-2]]. As doses get higher, there is a tendency for the dose needed in the Aligner: Maskless 01 to exceed the dose needed in Aligner: MA6-2.


'''Data represent dose-defocus tests on Si unless otherwise stated'''
*[[Specific Process Knowledge/Lithography/Resist#Aligner:_MA6_-_2|Information on UV exposure dose]]
 
{|border="1" cellspacing="1" cellpadding="7" style="text-align:left;"
|-
 
|-
|-style="background:silver; color:black"
|
!Date
!Thickness
!Exposure mode
!Dose
!Defoc
!Resolution
!Comments
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!rowspan="2"| AZ 5214E<br><span style="color:red">Old German version</span>
| 2021-08-19<br>jehem
| 1.5 µm
| Fast
| 80 mJ/cm<sup>2</sup>
| -4
| 2 µm
| Dev: SP60s
|-style="background:WhiteSmoke; color:black"
| 2021-08-19<br>jehem
| 1.5 µm
| Quality
| 80 mJ/cm<sup>2</sup>
| -4
| 1.25 µm
| Dev: SP60s
|-
 
|-
|-style="background:LightGrey; color:black"
!rowspan="2"| AZ 5214E image reversal<br><span style="color:red">Old German version</span>
| 2020-03-01<br>taran
| 2.2 µm
| Fast
| 43 mJ/cm<sup>2</sup>
| 0
| >2 µm (a lot of stitching)
| Reversal bake: 120s@110°C, Flood exposure: 200mJ/cm<sup>2</sup>, Dev: SP60s
|-style="background:LightGrey; color:black"
| 2021-08-25<br>jehem
| 2.2 µm
| Quality
| 26 mJ/cm<sup>2</sup>
| -4
| 1.75 µm
| Reversal bake: 120s@110°C, Flood exposure: 200mJ/cm<sup>2</sup>, Dev: SP60s
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!AZ MiR 701<br><span style="color:red">Old PFOA containing version</span>
| 2021-08-25<br>jehem
| 1.5 µm
| Fast
| 225 mJ/cm<sup>2</sup>
| -4
| 1.25 µm<br>Tested using dehydration reducing measures
| PEB: 60s@110°C, Dev: SP60s
|-style="background:WhiteSmoke; color:black"
|-
 
|-
|-style="background:LightGrey; color:black"
!rowspan="2"| AZ nLOF 2020
| 2020-02-01<br>jehem
| 2.0 µm
| Fast
| 300 mJ/cm<sup>2</sup>
| 0
| 2 µm (due to stitching)
| PEB: 60s@110°C, Dev: SP60s
|-style="background:LightGrey; color:black"
| 2020-03-01<br>taran
| 2.0 µm
| Quality
| 180-200 mJ/cm<sup>2</sup>
| 0
| 1 µm
| PEB: 60s@110°C, Dev: SP60s
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!AZ 5214E<br><span style="color:green">New Japanese version</span>
| 2023-01-06<br>jehem
| 1.5 µm
| Fast
| 80 mJ/cm<sup>2</sup>
| -2
| 1.75 µm
| Dev: SP60s
|-style="background:WhiteSmoke; color:black"
|-
 
|-
|-style="background:LightGrey; color:black"
!AZ 5214E image reversal<br><span style="color:green">New Japanese version</span>
| 2023-01-11<br>jehem
| 2.2 µm
| Fast
| 42 mJ/cm<sup>2</sup>
| -2
| 1.75 µm
| Reversal bake: 60s@110°C, Flood exposure: 500mJ/cm<sup>2</sup>, Dev: SP60s
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!AZ MiR 701<br><span style="color:green">New PFOA free version</span>
| 2021-08-25<br>jehem
| 1.5 µm
| Fast
| 225 mJ/cm<sup>2</sup>
| -4
| 1.25 µm (due to stitching)<br>Tested using dehydration reducing measures
| PEB: 60s@110°C, Dev: SP60s
|-
 
|-
|-style="background:LightGrey; color:black"
!AZ 4562<br><span style="color:green">New Japanese version</span>
| 2021-12-07<br>jehem
| 10 µm
| Fast
| 750 mJ/cm<sup>2</sup>
| 0
| ≤5 µm
| Priming: HMDS<BR>Rehydration after SB: 1 hour (may not be necessary)<br>Exposure: Multiple exposures with pauses, 5 x (10 s exposure + 10 s pause)<br>Degassing after exposure: 1 hour (may not be necessary)<br>Development: Multiple puddles, 5 x 60 s
|-
 
|}
<br>
'''Dehydration reducing measures used for testing AZ MiR 701:'''<br>
The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure.


==Writing speed==
==Writing speed==