Specific Process Knowledge/Etch/DRIE-Pegasus/DREM

DREM 2kW micro

DREM 2kW micro

Recipe	General							Pressure						Gases																Generators						Matching								Tem- pera- ture	Results
														C4F8						SF6						O2		Ar		Coil		Platen				Coil				Platen
	Platen		Stb	S/E	Dp	Et	Cyc	Dp			Et			Dp			Et			Dp			Et			Dp	Et	Dp	Et	Dp	Et	Dp	Et			Dp		Et		Dp		Et			Runs	Keywords
	U/D	H/L						D	B	M	D	B	M	D	B	M	D	B	M	D	B	M	D	B	M								D	B	M	L	T	L	T	L	T	L	T
DREM 2kW micro	Pump to base, Clamp Substrate, home platen matching unit, stabilisation																																												8
	U	HF		D/E	1.2	3				100%			100%	0.3@5	0.5@50	200	0.5@100		5	0.3@200	0.5@200	15	2@15	0.3@100	200			150	150	2	2	1	1@1	1@100	1	40	50	40	50	32.5	51.9	32.5	51.9	0
DREM 2kW micro	Pump to base, Clamp Substrate, home platen matching unit, stabilisation																																												1
	U	HF		D/E	1.2	3				100%			100%	0.3@5	0.5@50	200	0.5@100		5	0.3@200	0.5@200	15	2@15	0.3@100	200			150	150	2	2	1	1@1	1@100	1	40	50	40	50	32.5	51.9	32.5	51.9	-19

0 Home matching
	General	Time	Pressure	Gas	" >Power	Matching	Miscellaneous
Setting		90t	7T	sulf	yes, lots	lit	na

Overview of micro and nano fabrication steps - a guide to where you can find fabrication information in LabAdviser

Front Image - Dry your sample Thermal treatment of your sample Make a mask on your sample		Clean your sample Entry page in LabAdviser Techniques Materials Wafer cleaning Soap Sonic Removes dust and particles 7-up & Piranha Removes traces of organics and alkali ions RCA Two step process to remove traces of organics and metals 5% HF Removes native oxide IMEC Removing dust, traces of organics and alkali ions and slightly polish the surface. Make the surface hydrophillic Dry your sample Entry page in LabAdviser Techniques Materials Wafer and sample drying Spin dryers Whole wafers Critial point dryer Sensitive wafers Ethanol fume drying Sensitive wafers N2 blow drying N2 pistols Thermal treatment of your sample Entry page in LabAdviser Techniques Materials Thermal Process Annealing (>350C) Si, PECVD layers, Al, BCB curing, Polymer Oxidation Si wafers Doping with B/P Si wafers Pyrolysis Resists: AZ, SU8, PDMS Rapid Thermal Anneal (RTP) SiO2, Si3N4, Ti, III-V Lithography/Baking Baking (<300dg) baking resist and polymers Make a mask on your sample Entry page in LabAdviser Techniques Materials Lithography Pattern design & Mask fabrication Photolithography UV resists Deep UV lithography DUV resists E-beam lithography E-beam resists Imprinting Polymers