Specific Process Knowledge/Etch/Overview of chemicals: Difference between revisions
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!style="background:silver; color:black;" align="left"|Chemical | !style="background:silver; color:black;" align="left"|Chemical | ||
!style="background:LightGrey; color:black;"|Concentration | !style="background:LightGrey; color:black;"|Concentration | ||
!style="background:WhiteSmoke; color:black"|application | |||
!style="background:WhiteSmoke; color:black"|Comment | !style="background:WhiteSmoke; color:black"|Comment | ||
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Revision as of 12:34, 10 October 2022
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Chemical | Concentration | application | Comment |
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KOH | 28% | C | |
TextB2 | C | ||
Process parameter range | TextC1 |
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TextC2 |
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Substrates | TextD1 |
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TextD2 |
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TextD3 |
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