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Specific Process Knowledge/Etch/Aluminum Oxide/Al2O3 Etch with ICP Metal: Difference between revisions

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==Al2O3 etching by sanvis@nanolab [[Image:section under construction.jpg|70px]]==
==Al2O3 etching by sanvis@nanolab [[Image:section under construction.jpg|70px]]==
{| border="1" cellspacing="2" cellpadding="2"
|-style="background:Black; color:White"
! Parameter
|Nanoscale Al2O3 etch
|Microscale Al2O3 etch
|-
|Coil Power [W]
|300
|500
|-
|Platen Power [W]
|15
|70
|-
|Platen temperature [<sup>o</sup>C]
|0
|0
|-
|BCl3 flow [sccm]
|20
|40
|-
|Cl<sub>2</sub> flow [sccm]
|7
|15
|-
|Pressure [mTorr]
|1.2
|3.0
|-
|}
{| border="2" cellspacing="2" cellpadding="3"
|-style="background:DarkGray; color:White"
!Material to be etched
!Nanoscale Al2O3 etch
!Microscale Al2O3 etch
|-
|Etch rate
|'''6.25 nm/min on 6" wafer''',  ''Summer sanvis@nanolab''
|'''25 nm/min on small samples on Si carrier''', ''Summer sanvis@nanolab''
|-
|}
<br clear="all" />


==Al2O3 etching by bghe@nanolab==
==Al2O3 etching by bghe@nanolab==