Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
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== Studies of Cr deposition processes == | |||
[[/Deposition of Chromium|Uniformity of Cr layers]] - ''Uniformity of Cr layers deposited with different methods and settings'' | |||
[[/Sputtering of Cr in Wordentec|Sputtering of Cr in Wordentec]] - ''Settings and deposition rates'' | |||
[[/Sputtering of Cr in Sputter System (Lesker)|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates'' | |||
[[/Thermal evaporation of Cr in Thermal evaporator|Thermal evaporation of Cr in Thermal evaporator]] - ''Settings and deposition results'' | |||
[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cr:_High_tensile_stress|Stress in sputtered Cr films]] - ''Extremely high tensile stress in Cr films deposited at high temperature'' | |||
== Chromium deposition == | == Chromium deposition == | ||
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'''*''' ''For thicknesses above 600 nm, request permission from metal@nanolab.dtu.dk to ensure there is enough material.'' | '''*''' ''For thicknesses above 600 nm, request permission from metal@nanolab.dtu.dk to ensure there is enough material.'' | ||
Revision as of 08:31, 3 January 2023
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Studies of Cr deposition processes
Uniformity of Cr layers - Uniformity of Cr layers deposited with different methods and settings
Sputtering of Cr in Wordentec - Settings and deposition rates
Sputtering of Cr in Sputter system (Lesker) - Settings and deposition rates
Thermal evaporation of Cr in Thermal evaporator - Settings and deposition results
Stress in sputtered Cr films - Extremely high tensile stress in Cr films deposited at high temperature
Chromium deposition
Chromium can be deposited by e-beam evaporation, thermal evaporation, and sputter deposition. It should be noted that in e-beam evaporation, chromium does not melt but evaporates directly from the solid phase. In the chart below you can compare the different deposition equipment. Further down you will find the results of some studies on chromium deposition.
E-beam evaporation (Temescal) | E-beam evaporation and sputter deposition (Wordentec) | Thermal evaporation (Thermal evaporator) | Sputter deposition (Lesker sputterer) | Sputter deposition ((Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)) ) | |
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General description | E-beam deposition of Chromium | E-beam and sputter deposition of Chromium | Thermal deposition of Chromium | Sputter deposition of Chromium | Sputter deposition of Chromium |
Pre-clean | Ar ion bombardment | RF Ar clean | RF Ar clean | RF Ar clean | |
Layer thickness | 10Å to 1µm* | 10Å to 1µm* | 80 nm | at least up to 200 nm | at least up to 200 nm |
Deposition rate | 0.5 Å/s to 10 Å/s | 10 Å/s to 15 Å/s (e-beam)
Sputtering: Depends on process parameters. See here and process log. |
1 Å/s | Depends on process parameters. At least up to 1.48 Å/s. See process log. | Depends on process parameters. |
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Comment | Takes approx. 20 min to pump down | Takes approx. 1 hour to pump down | Takes approx. 20 min to pump down | Takes approx. 5 min to pump down load lock and 6 min for transfer to processing chamber |
* For thicknesses above 600 nm, request permission from metal@nanolab.dtu.dk to ensure there is enough material.