Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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=Stress measurement= | =Stress measurement= | ||
The stress in a thin film can be quantified with a [ | The stress in a thin film can be quantified with a [http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Profiler profilometer] by measuring the wafer bow before and after deposition of the film. If the thin film is deposited on both sides of the wafer, you can measure the bow after deposition and again after removing the film from one of the sides. | ||
If your thin film is crystalline, you can also measure stress using [[#Stress measurement using XRD|XRD]]. | If your thin film is crystalline, you can also measure stress using [[#Stress measurement using XRD|XRD]]. | ||
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*Here you can find some information about [[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|stress in sputtered films]] made at Nanolab. There is also a recommendation for a general reference to read. | *Here you can find some information about [[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|stress in sputtered films]] made at Nanolab. There is also a recommendation for a general reference to read. | ||
* | *Here you can find information about [[Specific Process Knowledge/Thin film deposition/Deposition of Nickel/Stress Wordentec Ni films|tensile stress in e-beam evaporated Ni films]]. | ||
*Here you can find a little information about [http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_NiFe tensile stress in Invar], a type of NiFe alloy. | |||
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