Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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Examples of thin films that exhibit tensile stress include Cr, Ni, and SiO2 made by LPCVD TEOS. SiN made by PECVD can exhibit either tensile or compressive stress. The same is true for sputtered Si. | Examples of thin films that exhibit tensile stress include Cr, Ni, and SiO2 made by LPCVD TEOS. SiN made by PECVD can exhibit either tensile or compressive stress. The same is true for sputtered Si. | ||
Here you can find some information about [[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|stress in sputtered films]] made at Nanolab. There is also a recommendation for a general reference to read. | *Here you can find some information about [[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|stress in sputtered films]] made at Nanolab. There is also a recommendation for a general reference to read. | ||
*This page has information about [[Specific Process Knowledge/Thin film deposition/Deposition of Nickel/Stress Wordentec Ni films|evaporated Ni films]]. | |||
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