Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
Appearance
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* MACS (Multiplex Atmospheric Cassette System) | * MACS (Multiplex Atmospheric Cassette System) | ||
2.2 | 2.2 Wafer requirements | ||
2.3 Process parameter space | |||
2. | 2.4 Standard processes | ||
2.4 | 2.4.1 Process A Large trench | ||
2.4.1 Process B Via etch | 2.4.1 Process B Via etch | ||
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3. System control | 3. System control | ||
Image: Description of the GUI | |||
3.1 Manual processing | 3.1 Manual processing | ||