Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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1.6 Overview of equipment | 1.6 Overview of equipment | ||
Image: The load lock and MACS | |||
Image: The source in the service area | |||
Image: The graphical user interface | |||
2 Technical specifications | 2 Technical specifications | ||
2.1 Hardware description | |||
2.2 Wafer requirements | |||
2. | |||
2. | 2.3 Hardware | ||
2. | 2.4 Standard processes | ||
2. | 2.4.1 Process A Large trench | ||
2. | 2.4.1 Process B Via etch | ||
2. | 2.4.1 Process C Microstamp | ||
2. | 2.4.1 Process D Nanostamp | ||