Specific Process Knowledge/Lithography/EBeamLithography/eLINE: Difference between revisions
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Notice that this estimate is only the beam dwell time and does not account for beam settling time or stage movement time. Typically process times are 3-4 times higher than the dwell time estimate but this will vary with pattern and writing conditions. | Notice that this estimate is only the beam dwell time and does not account for beam settling time or stage movement time. Typically process times are 3-4 times higher than the dwell time estimate but this will vary with pattern and writing conditions. | ||
[[Image:CurrentAperture.png|800x800px|left|thumb|Typical beam currents as function of voltage and aperture.]] | [[Image:CurrentAperture.png|800x800px|left|thumb|Typical beam currents [pA] as function of voltage and aperture.]] | ||
==Writing fields== | ==Writing fields== | ||
Aspects of WF, dimension and resolution, step size | Aspects of WF, dimension and resolution, step size | ||