Specific Process Knowledge/Etch/Aluminum Oxide/Al2O3 Etch with ICP Metal: Difference between revisions

From LabAdviser
← Older editNewer edit →
VisualWikitext
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,018 edits
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,018 edits
Line 90: Line 90:
Image:S038116_17.jpg
Image:S038116_17.jpg
Image:S038116_18.jpg
Image:S038116_18.jpg
</gallery>
<gallery>
Image:metalS038116top_03.jpg
Image:metalS038116top_04.jpg
Image:metalS038116top_06.jpg
Image:metalS038116top_07.jpg
Image:metalS038116top_08.jpg
Image:metalS038116top_09.jpg


</gallery>
</gallery>

Revision as of 14:00, 4 August 2022

Feedback to this page: click here


Al2O3 etching with the ICP metal

Parameter Recipe name: no name (testing recipe)
Coil Power [W] 1200
Platen Power [W] 200
Platen temperature [oC] 0
BCl3 flow [sccm] 60
Cl2 flow [sccm] 30
Pressure [mTorr] 4


Material to be etched Etch rate using the above parameters
Al2O3
  • ~93nm/min (30s, 1/4 wafer on 6" carrier)
    2017-01-20 bghe@nanolab


Al2O3 etching by sanvis@nanolab

Al2O3 etching by bghe@nanolab

Recipes

Al2O3 etch
Parameter Recipe 1:Al2O3 etch platen only
BCl3 (sccm) 15
Ar (sccm) 15
Pressure (mTorr) 5
Coil power (W) 0
Platen power (W) 30
Temperature (oC) 20
Spacers (mm) 100 mm

Results

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/Aluminum_Oxide/Al2O3_Etch_with_ICP_Metal&oldid=40870"