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Specific Process Knowledge/Thin film deposition/Deposition of ITO: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
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*RF sputtering of an ITO target - reactive sputtering possible
*RF sputtering of an ITO target - reactive sputtering possible
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*RF sputtering of an ITO target - reactive sputtering possible
*RF sputtering of an ITO target - reactive sputtering possible (not recommended due to arching)
*Pulsed DC sputtering of an ITO target - reactive sputtering possible
*Pulsed DC sputtering of an ITO target - reactive sputtering possible
*Reactive HIPIMS (high-power impulse magnetron sputtering) of an ITO target
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