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Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
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Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,093 edits
Line 75: Line 75:
192 mm
192 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
2xx mm
210 mm
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|style="background:LightGrey; color:black"|X-axis cut speed
|style="background:LightGrey; color:black"|X-axis cut speed
Line 81: Line 81:
0.1 - 300 mm/sec
0.1 - 300 mm/sec
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
??? mm/sec
0.1 - 800 mm/sec
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|style="background:LightGrey; color:black"|Y-axis cutting range
|style="background:LightGrey; color:black"|Y-axis cutting range
Line 87: Line 87:
162 mm
162 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
2xx mm
210 mm
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|-
|style="background:LightGrey; color:black"|Y-axis index step
|style="background:LightGrey; color:black"|Y-axis index step
Line 93: Line 93:
0.0002 mm
0.0002 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.0002 mm
0.0001 mm
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|style="background:LightGrey; color:black"|Y-axis single error
|style="background:LightGrey; color:black"|Y-axis single error
Line 99: Line 99:
0.003 or less
0.003 or less
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.003 or less
0.002 or less
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!style="background:silver; color:black" align="left"|Hardware settings
|style="background:LightGrey; color:black"|Maximum blade size
|style="background:WhiteSmoke; color:black"|
ø76.2 mm
|style="background:WhiteSmoke; color:black"|
ø76.2 mm
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
Line 123: Line 116:
*Thick metal (>0.75 mm)
*Thick metal (>0.75 mm)
*III-V samples
*III-V samples
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| style="background:LightGrey; color:black"|Accessories
|style="background:WhiteSmoke; color:black"|
*Manual wafer mounter for blue tape
|style="background:WhiteSmoke; color:black"|
*Manual wafer mounter for tape with backside foil (Powatec P200)
*Automatic Wafer cleaning station (Disco DCS 1441)
*UV curing station (Powatec U200)
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|}
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