Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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If you have thicker wafers then use several passes decreasing the blade height for each pass.<br> | If you have thicker wafers then use several passes decreasing the blade height for each pass.<br> | ||
For 500 µm thick wafers set blade height to 200µm (preferred).<br> | For 500 µm thick wafers set blade height to 200µm (preferred).<br> | ||
This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample. | This leaves 125µm uncut since blue tape is 75µm.<br> | ||
It is possible to cut through the sample. | |||
|-valign="top" | |-valign="top" | ||
|'''Max. sample thickness''' | |'''Max. sample thickness''' | ||