Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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|'''Recommended dice depth''' | |'''Recommended dice depth''' | ||
|Set blade height to 200µm (preferred).<br>This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample. | |Set blade height to 200µm (preferred).<br>This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample. | ||
|Do not cut deeper than 500 µm in each pass (for fused Silica and SiC 200 µm). If you have thicker wafers then several passes decreasing the blade height for each pass. | |Do not cut deeper than 500 µm in each pass (for fused Silica and SiC 200 µm). <br> | ||
For 500 µm thick wafers set blade height to 200µm (preferred).<br>This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample. | If you have thicker wafers then use several passes decreasing the blade height for each pass.<br> | ||
For 500 µm thick wafers set blade height to 200µm (preferred).<br> | |||
This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample. | |||
|-valign="top" | |-valign="top" | ||
|'''Max. sample thickness''' | |'''Max. sample thickness''' | ||