Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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*Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D). | *Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D). | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Chips | *Chips up to about 75 x 75 mm | ||
*4" wafer holder | *4" wafer holder | ||
*6" wafer holder (stage movement limited to central 100 x 100 mm region) | *6" wafer holder (stage movement limited to central 100 x 100 mm region) | ||