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Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,893 edits
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!rowspan="2"| AZ nLOF 2020
!rowspan="2"| AZ nLOF 2020
| Long ago
| 2021-02-22<br>jehem
|rowspan="2"| 2 µm
|rowspan="2"| 2 µm
|rowspan="2"| 375 nm
|rowspan="2"| 375 nm
| Fast
| Fast
| 400 mJ/cm<sup>2</sup>
| 350 mJ/cm<sup>2</sup>
| 5
| 0
| ~1 µm (not optimized)
| 1 µm (not optimized)
| PEB: 60s@110°C, Dev: SP60s <br> Probably under-exposed
| PEB: 120s@110°C, Dev: SP60s
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
| Long ago
| 2021-02-22<br>jehem
| Quality
| Quality
| 400 mJ/cm<sup>2</sup>
| 350 mJ/cm<sup>2</sup>
| 0
| 0
| 1 µm
| 1 µm
| PEB: 60s@110°C, Dev: SP60s <br> Probably under-exposed
| PEB: 120s@110°C, Dev: SP60s
|-
|-


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