Specific Process Knowledge/Lithography/EBeamLithography/FirstEBL: Difference between revisions

@@ Line 29: / Line 29: @@
 |'''Rinse'''
 |'''Remover'''
-|'''Process flows (in docx-format)'''
 |-
@@ Line 44: / Line 43: @@
 |IPA
 |AR-600-71, 1165 Remover
-|[[media:Process_Flow_CSAR.docx‎|Process Flow CSAR.docx‎]] <br> [[media:Process Flow CSAR ESPACER.docx|Process Flow CSAR with ESPACER]] <br> [[media:Process Flow CSAR with Al.docx|Process Flow CSAR with Al]] <br> [[media:Process_Flow_LOR5A_CSAR_Developer_TMAH_Manual.docx|Process Flow LOR5A with CSAR]] <br>
 |-
@@ Line 52: / Line 50: @@
 |[http://www.allresist.com AllResist]
 |Both e-beam and DUV sensitive resist. Currently being tested, contact [mailto:thope@dtu.dk Thomas Pedersen] for information.
-|
 |
 |
 |AR 300-47
-|H2O
+|DIW
 |
 |
@@ Line 70: / Line 67: @@
 |AR 300-47, TMAH
 |H2O
-|
 |
 |}