Specific Process Knowledge/Lithography/EBeamLithography/FirstEBL: Difference between revisions

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JEOL 9500: My First E-Beam Lithography Process

This page is a step by step guide to help new users through their first exposure on the JEOL 9500 system, (insert link to same page for Raith eLine Plus). In this guide we will set up an exposure job as an example. We will set it up as a dose test and hence keep it at a fairly low complexity level. The JEOL 9500 system has a fairly steep learning curve and we encourage all users to keep the complexity level of their first exposure similar to the job in this guide.

The job set up in this guide will go through the following steps

Spin coating of e-beam resist
Job file preparation
Pattern preparation including Proximity Effect Correction
Exposure
Development

Spin coating of resist

DTU Nanolab provides the following standard EBL resists.

Resist	Polarity	Comments	Technical reports	Spin Coater	Thinner	Developer	Rinse	Remover	Process flows (in docx-format)
CSAR	Positive	Standard positive resist, very similar to ZEP520.	Allresist_CSAR62_English.pdf‎,, CSAR_62_Abstract_Allresist.pdf‎	See table here	Anisole	AR-600-546, AR-600-548, N50, MIBK:IPA	IPA	AR-600-71, 1165 Remover	Process Flow CSAR.docx‎ Process Flow CSAR with ESPACER Process Flow CSAR with Al Process Flow LOR5A with CSAR
ZEP520A (not supplied by Nanolab anymore)	Positive resist, contact Lithography if you plan to use this resist	Positive resist	ZEP520A.pdf, ZEP520A spin curves on SSE Spinner	See table here	Anisole	ZED-N50/Hexyl Acetate,n-amyl acetate, oxylene. JJAP-51-06FC05.pdf‎, JVB001037.pdf‎	IPA	acetone/1165	Process_Flow_ZEP.docx
Copolymer AR-P 617	Positive	Approved, not tested yet. Used for trilayer (PE-free) resist-stack or double-layer lift-off resist stack. Please contact Lithography for information.	AR_P617.pdf‎	See table here	PGME	AR 600-55, MIBK:IPA		acetone/1165	Trilayer stack: Process_Flow_Trilayer_Ebeam_Resist.docx‎
mr EBL 6000.1	Negative	Standard negative resist	mrEBL6000 processing Guidelines.pdf‎	See table here	Anisole	mr DEV	IPA	mr REM	Process_Flow_mrEBL6000.docx‎
HSQ (XR-1541)	Negative	Approved. Standard negative resist	HSQ Dow Corning, MSDS HSQ	See table here		TMAH, AZ400K:H2O	H2O		process flow HSQ High resolution patterning with HSQ
AR-N 8200	Negative	AllResist	Both e-beam and DUV sensitive resist. Currently being tested, contact Thomas Pedersen for information.				AR 300-47	H2O
AR-N 7520	Negative	Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact Peixiong Shi for information.	AR-N7500-7520.pdf‎	See table here	PGMEA	AR 300-47, TMAH	H2O

@@ Line 22: / Line 22: @@
 |'''Resist'''
 |'''Polarity'''
-|'''Manufacturer'''
 |'''Comments'''
 |'''Technical reports'''
@@ Line 38: / Line 37: @@
 |'''[[Specific_Process_Knowledge/Lithography/CSAR|CSAR]]'''
 |Positive
-|[http://www.allresist.com AllResist]
 |Standard positive resist, very similar to ZEP520.
 |[[media:Allresist_CSAR62_English.pdf‎|Allresist_CSAR62_English.pdf‎]],, [[media:CSAR_62_Abstract_Allresist.pdf‎|CSAR_62_Abstract_Allresist.pdf‎]]
@@ Line 53: / Line 51: @@
 |'''[[Specific_Process_Knowledge/Lithography/ZEP520A|ZEP520A]]''' (not supplied by Nanolab anymore)
 |Positive resist, contact [mailto:Lithography@Nanolab.dtu.dk Lithography] if you plan to use this resist
-|ZEON
 |Positive resist
 |[[media:ZEP520A.pdf|ZEP520A.pdf]], [[media:ZEP520A.xls|ZEP520A spin curves on SSE Spinner]]
@@ Line 70: / Line 67: @@
 |'''[[Specific_Process_Knowledge/Lithography/ARP617|Copolymer AR-P 617]]'''
 |Positive
-|[http://www.allresist.com AllResist]
 |Approved, not tested yet. Used for trilayer (PE-free) resist-stack or double-layer lift-off resist stack. Please contact [mailto:Lithography@nanolab.dtu.dk Lithography] for information.
 |[[media:AR_P617.pdf‎|AR_P617.pdf‎]]
@@ Line 84: / Line 80: @@
 |'''[[Specific_Process_Knowledge/Lithography/mrEBL6000|mr EBL 6000.1]]'''
 |Negative
-|[http://http://www.microresist.de/home_en.htm MicroResist]
 |Standard negative resist
 |[[media:mrEBL6000 Processing Guidelines.pdf‎|mrEBL6000 processing Guidelines.pdf‎]]
@@ Line 100: / Line 95: @@
 |'''HSQ (XR-1541)'''
 |Negative
-|DOW Corning
 |Approved. Standard negative resist
 |[[media:DowCorningHSQA.pdf|HSQ Dow Corning]], [[media:MSDS HSQ.pdf|MSDS HSQ]]
@@ Line 129: / Line 123: @@
 |'''AR-N 7520'''
 |Negative
-|[http://www.allresist.com AllResist]
 |Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact [mailto:pxshi@dtu.dk Peixiong Shi] for information.
 |[[media:AR-N7500-7520.pdf‎|AR-N7500-7520.pdf‎]]
@@ Line 141: / Line 134: @@
 |}
-Table