Specific Process Knowledge/Lithography/Strip: Difference between revisions

@@ Line 41: / Line 41: @@
 |style="background:WhiteSmoke; color:black"|
 Solvent and ultra sound
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
@@ Line 110: / Line 109: @@
 *1 - 25 100 mm wafers
 *1 - 25 150 mm wafers
 |-
 |style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black"|
-Silicon, glass, and polymer substrates
+*Silicon, glass, and polymer substrates
+*Film or pattern of all but Type IV
-Film or pattern of all but Type IV
 |style="background:WhiteSmoke; color:black"|
-No metal!
+<b>No metal allowed!</b>
+*Silicon, glass, and polymer substrates
-Silicon, glass, and polymer substrates
+*Film or pattern of photoresist/polymer
-Film or pattern of photoresist/polymer
 |style="background:WhiteSmoke; color:black"|
-Silicon, III-V, and glass substrates
+*Silicon, III-V, and glass substrates
+*Film or pattern of all but Type IV
-Film or pattern of all but Type IV
 |style="background:WhiteSmoke; color:black"|
-No metal!
+<b>No metal allowed!</b>
+*Silicon, glass, and polymer substrates
-Silicon, glass, and polymer substrates
+*Film or pattern of photoresist/polymer
-Film or pattern of photoresist/polymer
 |style="background:WhiteSmoke; color:black"|
-Silicon and glass substrates
+*Silicon and glass substrates
+*Film or pattern of all but Type IV
-Film or pattern of all but Type IV
 |-
 |}