Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

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 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
 |style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
-|style="background:WhiteSmoke; color:black"|<b>Flip-chip bonder</b>
 |-
 !style="background:silver; color:black;" align="center" width="60"|Purpose
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 *Fine placement of dies
 *Eutectic metal soldering
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-*Fine placement of dies
-*Glue attachment
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 !style="background:silver; color:black;" align="center" width="60"|Performance
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 *Low thermal resistance
 *Always conducting
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-*Medium or High thermal resistance
-*Possibility of both conducting and isolating adhesives
-*If an epoxy based adhesive is used the user is required to have the epoxy course.
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 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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 *Should be able to withstand the soldering temperature
 *Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
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-*Any that is compatible with the glue and temperature used
 |-
 |}
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