Specific Process Knowledge/Thermal Process: Difference between revisions
| Line 30: | Line 30: | ||
*[[/Jipelec RTP|RTP Jipelec]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | *[[/Jipelec RTP|RTP Jipelec]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | ||
*[[/RTP Jipelec 2|RTP Jipelec 2]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | *[[/RTP Jipelec 2|RTP Jipelec 2]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | ||
*[[/RTP ANNEALSYS|RTP ANNEALSYS]] - ''For rapid thermal annealing of Si based materials'' | |||
*[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers'' | *[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers'' | ||