Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
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! General description | ! General description | ||
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E-beam deposition of Aluminium | E-beam deposition of Aluminium | ||
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! Pre-clean | ! Pre-clean | ||
|Ar ion etch | |Ar ion etch | ||
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|RF Ar clean | |RF Ar clean | ||
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|RF Ar clean | |RF Ar clean | ||
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|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | ! Layer thickness | ||
|10Å to 1 µm* | |10Å to 1 µm* | ||
|10Å to 1 µm* | |10Å to 1 µm* | ||
|10Å to ~0.5µm | |10Å to ~0.5µm | ||
|10Å to ~0.5µm (very time consuming ) | |10Å to ~0.5µm (very time consuming ) | ||
|10Å to ~0.5µm | |10Å to ~0.5µm | ||
|10Å to 0. | |10Å to 0.12 µm | ||
|10Å to 1 µm | |10Å to 1 µm* | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
|0.5Å/s to 15Å/s | |0.5Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
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*Up to 4x6" or 3x8" wafers | *Up to 4x6" or 3x8" wafers | ||
*smaller pieces | *smaller pieces | ||
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Approx. 20 min | Approx. 20 min | ||
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Approx. 1 hour | Approx. 1.5 hour | ||
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Approx. 1 hour | Approx. 1.5 hour | ||
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Approx. 10 min | Approx. 10 min | ||
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Approx. 5 min plus 6 min transfer time | Approx. 5 min plus 6 min transfer time | ||
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Approx. 1 hour | Approx. 1,5 hour | ||
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Approx. 15 min | Approx. 15 min | ||
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* Silicon wafers | * Silicon wafers | ||
* Quartz wafers | * Quartz wafers | ||
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* Metals | * Metals | ||
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It is possible to tilt the substrate. | It is possible to tilt the substrate. | ||
|'''*''' Thickness above 600 nm: ask for permission. | |'''*''' Thickness above 600 nm: ask for permission. | ||
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|''' | |'''**'''Thickness above 120 nm: ask for permission | ||
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|} | |} | ||
'''*''' ''For | '''*''' ''For cumulative deposition above 600 nm please write to metal@nanolab.dtu.dk to make sure there will be enough Al for your deposition'' | ||
==Aluminium deposition on ZEP520A for lift-off - comparison of thermal and e-beam evaporation == | ==Aluminium deposition on ZEP520A for lift-off - comparison of thermal and e-beam evaporation == | ||