Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions
→Titanium deposition: removed physimeca |
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
|E-beam deposition of Titanium | |E-beam deposition of Titanium | ||
|E-beam deposition of Titanium | |E-beam deposition of Titanium | ||
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! Pre-clean | ! Pre-clean | ||
|Ar ion beam | |Ar ion beam | ||
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|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|10Å to 1 µm* | |10Å to 1 µm* | ||
|10Å to 1 µm* | |10Å to 1 µm* | ||
|. | |. | ||
|. | |. | ||
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|0.5Å/s to 10Å/s | |0.5Å/s to 10Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]]. | |Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]]. | ||
|Depending on process parameters, about 1 Å/s. | |Depending on process parameters, about 1 Å/s. | ||
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*6x4" wafers or | *6x4" wafers or | ||
*6x6" wafers | *6x6" wafers | ||
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*24x2" wafers or | *24x2" wafers or | ||
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* | *Almost any as long as they do not degas. See cross-contamination sheet. | ||
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* | *Almost any as long as they do not degas. See cross-contamination sheet. | ||
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* | *Almost any as long as they do not degas. See cross-contamination sheet. | ||
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*Almost any as long as they do not degas at the substrate temperature used for your process. See cross-contamination | *Almost any as long as they do not degas at the substrate temperature used for your process. See cross-contamination sheet. | ||
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*Almost any as long as they do not degas at the substrate temperature used for your process. See cross-contamination | *Almost any as long as they do not degas at the substrate temperature used for your process. See cross-contamination sheet. | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Allowed materials | !Allowed materials | ||
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* | *Almost any as noted above | ||
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* | *Almost any as noted above | ||
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* | *Almost any as noted above | ||
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*Almost any as noted above | *Almost any as noted above | ||
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