Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Temescal|E Beam Evaporator (Temescal)]] | *[[/Temescal|E Beam Evaporator (Temescal)]] | ||
*[[/Physimeca|Physimeca]] - ''E-beam evaporator'' | *[[/Physimeca|Physimeca]] - ''E-beam evaporator'' | ||
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system'' | *[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system'' | ||
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system'' | *[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system'' |
Revision as of 14:47, 21 April 2022
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Choose material to deposit
Semiconductors | Oxides | Nitrides | Metals | Alloys | Transparent conductive oxides | Polymers | Multilayers |
Aluminium Oxide (Al2O3)
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Silicon Nitride - and oxynitride
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Aluminium
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AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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