Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM/DREM 0.5kW v2.3: Difference between revisions
Created page with "koll" |
No edit summary |
||
Line 1: | Line 1: | ||
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | |||
|- | |||
! rowspan="2" width="40"| Date | |||
! colspan="2" width="120"| Substrate Information | |||
! colspan="4" | Process Information | |||
! colspan="3" width="200" | Results | |||
|- | |||
! width="30" | Wafer info | |||
! width="40" | Material/ Exposed area | |||
! width="40" | Condi- tioning | |||
! width="40" | Recipe | |||
! width="40" | Wafer ID | |||
! width="40" | Comments | |||
! width="400" |SEM images | |||
! width="100" |Picoscope | |||
! width="600" |Numbers | |||
|- | |||
|16/6-2021 | |||
|150 mm wafer with standard DUV resist and PegReticle pattern | |||
|Si / 25-50% | |||
|C06692.03 pegreticle wafer | |||
|nanolab/ jmli / DREM / DREM 0.5kW v2.3, 50 cycles or 4:35 minutes | |||
|C06694.01 | |||
|[http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=388881 Process log entry] | |||
| | |||
[[file:C06694.01c153.png |120px|frameless ]] | |||
[[file:C06694.01c154.png |120px|frameless ]] | |||
[[file:C06694.01c155.png |120px|frameless ]] | |||
[[file:C06694.01c156.png |120px|frameless ]] | |||
[[file:C06694.01c157.png |120px|frameless ]] | |||
[[file:C06694.01c158.png |120px|frameless ]] | |||
| <!-- Add picos here:[[file:S014009 1.gif |120px|frameless ]] --> | |||
| | |||
{| {{table}} | |||
| align="center" style="background:#f0f0f0;"|'''SEM image:''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06694.01c155.png c155]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06694.01c157.png c157]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06694.01c153.png c153]''' | |||
|- | |||
| Trench width (um)||0.21||0.79||0.84 | |||
|- | |||
| Etched depth (um)||1.08||1.27||1.41 | |||
|- | |||
| Etch rate (um/min)||0.24||0.28||0.31 | |||
|- | |||
| <span title="The cycles will vary if the aspect ratio is large "> Etch rate (nm/cyc) </span>||21.61||25.46||28.14 | |||
|- | |||
| Sidewall bowing (%)||0||1||0 | |||
|- | |||
| Sidewall angle (degs)||90.31||90.19||90.3 | |||
|- | |||
| Bottom bowing (%)||40.66||22.98||21.46 | |||
|- | |||
|Aspect ratio||5.04||1.6||1.67 | |||
|- | |||
|} | |||
|- | |||
|16/6-2021 | |||
|150 mm wafer with standard DUV resist and a pattern of pillars of variable densities/widths | |||
|Si / 10% | |||
|C06695.14 | |||
|nanolab/ vy / DREM / DREM 0.5 kW v2.3 75 cyc or 6:52.5 mins | |||
|C06694.01 | |||
|[http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=388881 Process log entry] | |||
| | |||
[[file:C06695.14c159.png |120px|frameless ]] | |||
[[file:C06695.14c160.png |120px|frameless ]] | |||
[[file:C06695.14c161.png |120px|frameless ]] | |||
[[file:C06695.14c162.png |120px|frameless ]] | |||
[[file:C06695.14c163.png |120px|frameless ]] | |||
| <!-- Add picoscope links here:[[file:C06694.14 |120px|frameless ]] --> | |||
| | |||
{| {{table}} | |||
| align="center" style="background:#f0f0f0;"|'''SEM image:''' | |||
|- | |||
| Trench width (um) | |||
|- | |||
| Etched depth (um) | |||
|- | |||
| Etch rate (um/min) | |||
|- | |||
| <span title="The cycles will vary if the aspect ratio is large "> Etch rate (nm/cyc) </span> | |||
|- | |||
| Sidewall bowing (%) | |||
|- | |||
| Sidewall angle (degs) | |||
|- | |||
| Bottom bowing (%) | |||
|- | |||
|Aspect ratio | |||
|- | |||
|} | |||
|- | |||
|27/9-2021 | |||
|DUV litho wafer, | |||
|Si / 25-50% | |||
|C06873.01 | |||
|nanolab/ jmli / DREM / DREM 0.5kW peg3, 100 cycles or 9:10 minutes | |||
|C06873.02 | |||
|30 sec O2 0.2kW barc[http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&usageid=397212 Process log entry] | |||
| | |||
[[file:C06873.02c156.png |120px|frameless ]] | |||
[[file:C06873.02c157.png |120px|frameless ]] | |||
[[file:C06873.02c158.png |120px|frameless ]] | |||
[[file:C06873.02c159.png |120px|frameless ]] | |||
[[file:C06873.02c160.png |120px|frameless ]] | |||
[[file:C06873.02c161.png |120px|frameless ]] | |||
[[file:C06873.02c162.png |120px|frameless ]] | |||
[[file:C06873.02c163.png |120px|frameless ]] | |||
| <!-- Add picoscope links here:[[file:C06873.02 |120px|frameless ]] --> | |||
| | |||
{| {{table}} | |||
| align="center" style="background:#f0f0f0;"|'''SEM image:''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c157.png c157]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c158.png c158]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c159.png c159]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c161.png c161]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c162.png c162]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c160.png c160]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c156.png c156]''' | |||
| align="center" style="background:#f0f0f0;"|'''[http://labadviser.nanolab.dtu.dk/index.php/File:C06873.02c163.png c163]''' | |||
|- | |||
| Trench width (um)||0.17||0.22||0.25||0.42||0.43||0.52||0.55||2.03 | |||
|- | |||
| Etched depth (um)||1.3||1.36||1.4||1.56||1.57||1.62||1.64||1.87 | |||
|- | |||
| Etch rate (um/min)||0.14||0.15||0.15||0.17||0.17||0.18||0.18||0.2 | |||
|- | |||
| <span title="The cycles will vary if the aspect ratio is large "> Etch rate (nm/cyc) </span>||13||14||14||16||16||16||16||19 | |||
|- | |||
| Sidewall bowing (%)||0||0.2||0.2||0.3||0.4||0.1||-0.1||0.1 | |||
|- | |||
| Sidewall angle (degs)||89.38||89.33||89.41||89.29||89.43||89.44||89.4||89.21 | |||
|- | |||
| Bottom bowing (%)||34.34||24.69||27.76||23.55||22.1||20.81||23.56||11.77 | |||
|- | |||
|Aspect ratio||8.11||6.63||5.94||3.85||3.77||3.22||3.1||0.93 | |||
|- | |||
|} | |||
|- | |||
|} |
Revision as of 10:27, 21 January 2022
Date | Substrate Information | Process Information | Results | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wafer info | Material/ Exposed area | Condi- tioning | Recipe | Wafer ID | Comments | SEM images | Picoscope | Numbers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
16/6-2021 | 150 mm wafer with standard DUV resist and PegReticle pattern | Si / 25-50% | C06692.03 pegreticle wafer | nanolab/ jmli / DREM / DREM 0.5kW v2.3, 50 cycles or 4:35 minutes | C06694.01 | Process log entry |
| |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
16/6-2021 | 150 mm wafer with standard DUV resist and a pattern of pillars of variable densities/widths | Si / 10% | C06695.14 | nanolab/ vy / DREM / DREM 0.5 kW v2.3 75 cyc or 6:52.5 mins | C06694.01 | Process log entry |
| |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
27/9-2021 | DUV litho wafer, | Si / 25-50% | C06873.01 | nanolab/ jmli / DREM / DREM 0.5kW peg3, 100 cycles or 9:10 minutes | C06873.02 | 30 sec O2 0.2kW barcProcess log entry |
|