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Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Ajoe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
222 edits
Line 84: Line 84:
|-valign="top"
|-valign="top"
|'''Recommended dice depth'''
|'''Recommended dice depth'''
|Leave 200 µm uncut. It's possible to cut through the sample.
|Leave 200 µm uncut(preferred).<br> It is possible to cut through the sample.
|Leave 200 µm uncut. It's possible to cut through the sample.
|Leave 200 µm uncut (preferred). <br> It is possible to cut through the sample.
|-valign="top"
|-valign="top"
|'''Max. sample thickness'''
|'''Max. sample thickness'''
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