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Specific Process Knowledge/Back-end processing: Difference between revisions

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* Stylus profilometer measurements
* Stylus profilometer measurements
**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
* Substrate/chip/die cleaning
**[[/Packlab Plasma Asher Pico 2|Packlab Plasma Asher Pico 2]]
* Chip/die mounting
* Chip/die mounting
**[[/Die Bonder|Die Bonder (eutectic metal)]]
**[[/Die Bonder|Die Bonder (eutectic metal)]]
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