Specific Process Knowledge/Wafer and sample drying/Critical Point Dryer: Difference between revisions
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After drying wafers in air, the majority of the cantilevers are bended and sticking to the underlying surface. | After drying wafers in air, the majority of the cantilevers are bended and sticking to the underlying surface. | ||
[[Image:SiN cantilevers dryed air.ppt|300x300px|thumb|Critical point dryer: positioned in cleanroom 4]] | |||
Dried in air: most cantilevers are bended. | Dried in air: most cantilevers are bended. | ||