Specific Process Knowledge/Etch/Aluminum Oxide: Difference between revisions
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Etching Al<sub>2</sub>O<sub>3</sub> can be done both chemically (wet) and by dry etching. | Etching Al<sub>2</sub>O<sub>3</sub> can be done both chemically (wet) and by dry etching. | ||
Chemical etching can be done using | Chemical etching can be done using BHF (60nm/min) or a developer (4nm/min). This will be selective to most materials not containing Al. | ||
We have done some test of Al<sub>2</sub>O<sub>3</sub> in dry etching. It has been mostly tested in the III-V ICP and ICP Metal. Please see links below. | We have done some test of Al<sub>2</sub>O<sub>3</sub> in dry etching. It has been mostly tested in the III-V ICP and ICP Metal. Please see links below. | ||
Revision as of 12:11, 3 September 2021
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Etching Al2O3 can be done both chemically (wet) and by dry etching. Chemical etching can be done using BHF (60nm/min) or a developer (4nm/min). This will be selective to most materials not containing Al. We have done some test of Al2O3 in dry etching. It has been mostly tested in the III-V ICP and ICP Metal. Please see links below.