Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3: Difference between revisions
| Line 34: | Line 34: | ||
Compared to a standard SPTS DRIE Pegasus chamber, the Pegasus 3 has had the same modifications as the Pegasus 1 with the exception of the Claritas EPD system. The changes are listed below. | Compared to a standard SPTS DRIE Pegasus chamber, the Pegasus 3 has had the same modifications as the Pegasus 1 with the exception of the Claritas EPD system. The changes are listed below. | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange| | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|High flow plenum upgrade]] | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope|Addition of Picoscope oscilloscope system for process monitoring]] | |||
* | The original (fast switching and with a maximum flow of 1200 sccm) SF<sub>6</sub> MFC was causing problems for a long a time so it was replaced by two new MFC's. | ||
* SF6-1: Fast switching MFC for Bosch processes with a maximum flow rate of 600 sccm. It sits in the position of the old 1200 sccm MFC on top of the plasma source.* SF6-2: Normal MFC for continuous processes with a maximum flow rate of 100 sccm. It is installed in the gas cabinet next to the Ar MFC. | |||