Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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A dehydration bake prior to spin coating can be enough, especially if adhesion is not critical, and if the resist is not left more than a day or two on the surface. Application of dip/spin-on adhesion promoter can improve the adhesion and shelf life. If adhesion is critical in the subsequent process step, application of a thin layer of SiO<sub>2</sub> using PECVD (followed by HMDS priming) as an adhesion layer is recommended. | A dehydration bake prior to spin coating can be enough, especially if adhesion is not critical, and if the resist is not left more than a day or two on the surface. Application of dip/spin-on adhesion promoter can improve the adhesion and shelf life. If adhesion is critical in the subsequent process step, application of a thin layer of SiO<sub>2</sub> using PECVD (followed by HMDS priming) as an adhesion layer is recommended. | ||
Overview of what pretreatment is used for various surfaces at DTU Nanolab. Parentheses () indicate the method is not the best, or that the information is from | Overview of what pretreatment is used for various surfaces at DTU Nanolab. Parentheses () indicate the method is not the best, or that the information is taken from product information supplied by manufacturers. | ||
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