Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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'''General comment regarding III-V materials:''' | '''General comment regarding III-V materials:''' | ||
A dehydration bake prior to spin coating can be enough, especially if adhesion is not critical, and if the resist is not left more than a day or two on the surface. Application of dip/spin-on adhesion promoter can improve the adhesion and shelf life. If adhesion is critical in the subsequent process step, application of a thin layer of SiO<sub>2</sub> using PECVD (followed by HMDS priming) as an adhesion layer is recommended. | A dehydration bake prior to spin coating can be enough, especially if adhesion is not critical, and if the resist is not left more than a day or two on the surface. Application of dip/spin-on adhesion promoter can improve the adhesion and shelf life. If adhesion is critical in the subsequent process step, application of a thin layer of SiO<sub>2</sub> using PECVD (followed by HMDS priming) as an adhesion layer is recommended. | ||
{| {{table } } | {| {{table } } | ||