Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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=Pretreatment= | =Pretreatment= | ||
Pretreatment is done before spin coating in order to ensure the best conditions for adhesion between the substrate surface and the resist. Pretreatment ranges from a simple dehydration bake over etching the native oxide to vapor phase deposition of an adhesion promoter. | |||
All surfaces can be divided to hydrophilic or hydrophobic surfaces. Oxidized surfaces such as SiO2 or surfaces with native oxide (e.g. Si or Al substrates) are considered to be hydrophilic and have very bad wetting with hydrophobic resist. The adhesion of most resists on hydrophilic surfaces is deteriorated if moisture is present on the surface. | All surfaces can be divided to hydrophilic or hydrophobic surfaces. Oxidized surfaces such as SiO2 or surfaces with native oxide (e.g. Si or Al substrates) are considered to be hydrophilic and have very bad wetting with hydrophobic resist. The adhesion of most resists on hydrophilic surfaces is deteriorated if moisture is present on the surface. | ||
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==Pretreatment of | ==Pretreatment of different surfaces== | ||
'''This section is under construction [[Image:section under construction.jpg|70px]]''' | '''This section is under construction [[Image:section under construction.jpg|70px]]''' | ||