Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= Chamber conditioning and cleaning | |ItemName= Chamber conditioning and cleaning | ||
|ItemConfiguration= Running long oxygen cleans is not necessary and must be avoided. | |ItemConfiguration= Running long oxygen cleans is not necessary and must be avoided. Neither are shorter cleans between wafers. | ||
|ItemComment= The absence of carbon containing etch gasses ensures that the process chamber is kept clean. | |ItemComment= The absence of carbon containing etch gasses ensures that the process chamber is kept clean. | ||
}} | }} | ||