Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

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== Current setup and rules on Pegasus 2 ==
== Current setup and rules on Pegasus 2 ==


Click [[Specific Process Knowledge/DRIE-Pegasus/Pegasus-2/OldConfig | '''here''']] to access older configurations.
Click [[Specific Process Knowledge/DRIE-Pegasus/Pegasus-2/OldConfig | '''here''']] to access older configurations.


The current configuration is
The current configuration is


{{Template:Peg2configheader1
{{Template:Peg2configheader1
|TableHeader= Currently valid from November 2020 onwards
|TableHeader= Currently valid from November 2020 onwards
}}
}}
{{Template:Peg2configcontent1
{{Template:Peg2configcontent1
|ItemName= Available gasses and gas chemistry
|ItemName= Available gasses and gas chemistry
 
|ItemConfiguration= '''Available gasses:'''
|ItemConfiguration= .
 
* SF<sub>6</sub>: 50 sccm
* SF<sub>6</sub>: 50 sccm
* O<sub>2</sub>: 50 sccm
* O<sub>2</sub>: 50 sccm
* Ar: 283  
* Ar: 283  
* C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm
* N<sub>2</sub>: 500 sccm
* N<sub>2</sub>: 500 sccm
* He: 11 sccm
* He: 11 sccm
'''Not available:'''
* C<sub>4</sub>F<sub>8</sub> (H<sub>2</sub> currently fitted but closed) : 0 sccm
* CO<sub>2</sub>: (It is not in the software)  
* CO<sub>2</sub>: (It is not in the software)  
|ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up
|ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up
}}
}}



Revision as of 10:33, 14 December 2020

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Current setup and rules on Pegasus 2

Click here to access older configurations.

The current configuration is

Access to Pegasus 2 configuration templates

Pegasus 2 configuration table version 1

Currently valid from November 2020 onwards
Item The currently applied modification Comments
Available gasses and gas chemistry Available gasses:
  • SF6: 50 sccm
  • O2: 50 sccm
  • Ar: 283
  • N2: 500 sccm
  • He: 11 sccm

Not available:

  • C4F8 (H2 currently fitted but closed) : 0 sccm
  • CO2: (It is not in the software)
OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up