Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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* SF<sub>6</sub>: 50 sccm | * SF<sub>6</sub>: 50 sccm | ||
* | * O<sub>2</sub>: 50 sccm | ||
* Ar: 283 sccm | * Ar: 283 sccm | ||
* | * N<sub>2</sub>: 500 sccm | ||
* He: 11 sccm | * He: 11 sccm | ||
* | * CO<sub>2</sub>: (It is not in the software) | ||
|ItemComment= | |ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up | ||
}} | }} | ||