Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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* CO2: (It is not in the software) | * CO2: (It is not in the software) | ||
|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | |ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | ||
}} | |||
=== Access to Pegasus 2 configuration templates === | === Access to Pegasus 2 configuration templates === | ||