Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= | |ItemName= Available gasses and gas chemistry | ||
|ItemConfiguration= | |ItemConfiguration= | ||
|ItemComment= | * C<sub>4<\sub>F<sub>8<\sub> (H2 currently fitted but closed) : 0 sccm | ||
* SF6: 50 sccm | |||
* O2: 50 sccm | |||
* Ar: 283 sccm | |||
* N2: 500 sccm | |||
* He: 11 sccm | |||
* CO2: (It is not in the software) | |||
|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | |||
}} | }} | ||
|} | |} | ||
Revision as of 15:10, 11 December 2020
Feedback to this page: click here
This system is a research tool and not available to the users
If you want to get access to the tool, then talk to professor Henry Jansen
Current setup and rules on Pegasus 2
Click here to access older configurations.
The current configuration is
| Item | The currently applied modification | Comments |
|---|---|---|
| Available gasses and gas chemistry | * C4<\sub>F8<\sub> (H2 currently fitted but closed) : 0 sccm
|
OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up |
Access to Pegasus 2 configuration templates
Pegasus 2 configuration table version 1
- Table header: Template:Peg2configheader1
- Table content: Template:Peg2configcontent1