Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= | |ItemName= Available gasses and gas chemistry | ||
|ItemConfiguration= | |ItemConfiguration= | ||
|ItemComment= | * C<sub>4<\sub>F<sub>8<\sub> (H2 currently fitted but closed) : 0 sccm | ||
* SF6: 50 sccm | |||
* O2: 50 sccm | |||
* Ar: 283 sccm | |||
* N2: 500 sccm | |||
* He: 11 sccm | |||
* CO2: (It is not in the software) | |||
|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | |||
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